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Product Details:
Payment & Shipping Terms:
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| Base Material:: | Fr4 94v0 TG150C | Board Thickness: | 0.2mm-4.5mm |
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| Min. Line Width: | 0.08mm | Copper Thickness: | 1/2 Oz-4 Oz |
| Finish Hole Size:: | PTH ±0.003'' ,NPTH ±0.002" | Board Thicknes: | 0.2-4.0mm |
| SMT/DIP Service:: | 0.3mm IC,BGA,QFP,0201 Components | Surface Finishing: | HASL-LF/OSP/ENIG Etc |
| Highlight: | TG150C Pcb Power Control Board,TG150C Power Bank Control Board,TG150C power bank pcb |
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ODM OEM Power PCBA Programming And Assembly Power Control PCBA For Power Bank
PCBA Capability
| Technology | SMT, THT |
| SMT capability | 4,000,000 points per day |
| DIP capability | 600,000 points per day |
| Experiences | QFP, BGA, μBGA, CBGA |
| Process | Lead-free |
| Programming | Yes |
| Conformal coating | Yes |
PCB capability
| Layer count | 1-18 layers |
| Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,rogers,nelco |
| Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
| Board thickness | 8-236mil(0.2-6.0mm) |
| Min.line width/space | 3/3 mil(75/75um) |
| Min. drill size | 8 mil(0.2mm) |
| Min. HDI laser drill size | 3 mil(0.067mm) |
| Tolerance of hole size | 2 mil(0.05mm) |
| PTH copper thickness | 1 mil(25 um) |
| Solder mask color | Customized |
| Peelable solder mask | Yes |
| surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold |
| Gold thickness | 2-30u" (0.05-0.76um) |
| Blind hole/buried hole | Yes |
| V-cut | Yes |
One stop services
1. PCB manufacturing
2. Components souring
3. Final products assemblying
4. Consumer products manufacturing(charger, DC cinverter, DC power supply etc)
Contact Person: admin
Tel: +8615218738899